Prediction of recrystallization times in electroplated copper thin films
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چکیده
منابع مشابه
Effect of passivation on stress relaxation in electroplated copper films
The present study investigated the effect of passivation on the kinetics of interfacial mass transport by measuring stress relaxation in electroplated Cu films with four different cap layers: SiN, SiC, SiCN, and a Co metal cap. Stress curves measured under thermal cycling showed different behaviors for the unpassivated and passivated Cu films, but were essentially indifferent for the films pass...
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The plane-strain bulge test is used to investigate the mechanical behavior of freestanding electroplated Cu thin films as a function of film thickness and microstructure. The stiffness of the films increases slightly with decreasing film thickness because of changes in the crystallographic texture and the elastic anisotropy of Cu. Experimental stiffness values agree well with values derived fro...
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چکیده ندارد.
15 صفحه اولEffects of Process Conditions on Properties of Electroplated Ni Thin Films for Microsystem Applications
Effects of Process Conditions on Properties of Electroplated Ni Thin Films for Microsystem Applications J. K. Luo, M. Pritschow, A. J. Flewitt, S. M. Spearing,* N. A. Fleck, and W. I. Milne Department of Engineering, University of Cambridge, Cambridge CB3 0FA, United Kingdom Institute for Microelectronics Stuttgart, 70569 Stuttgart, Germany School of Engineering Science, University of Southampt...
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ژورنال
عنوان ژورنال: Thin Solid Films
سال: 2016
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2016.06.056